论文
[1] Chen, Y. , Li, B. , Wang, X. , Wang, X. , & Li, H. . (2020). Direct phase-change cooling of vapor chamber integrated with igbt power electronic module for automotive application. IEEE Transactions on Power Electronics, PP(99), 1-1.
[2] Li, B. , Y Chen, Wang, X. , Y Li, & Y Yan. (2020). Heat spreading performance of sic-based power module with bonded vapour chamber for electric powertrain integration. Applied Thermal Engineering.
[3] Chen, Y. , Li, B. , Wang, X. , Yan, Y. , Wang, Y. , & Qi, F. . (2019). Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for igbt power module. Thermal Science & Engineering Progress.
[4] Chen, Y. , Yan, Y. , & Li, B. . (2020). Thermal analyses of power electronics integrated with vapour chamber cooling. Automotive Innovation.
[5] Chen, Y. , Li, B. , Yan, Y. , & Wang, Y. . (2018). MODELING AND EXPERIMENTAL ANALYSIS OF HEAT TRANSFER FOR POWER ELECTRONIC MODULE INTEGRATED WITH PHASE CHANGE THERMAL MANAGEMENT SYSTEM. International Heat Transfer Conference 16.
[6] Chen,Y., Y Yan., Li,B., Gong, W. .(2017). Thermal Characterization Analysis of IGBT Power Module Integrated with a Vapour Chamber and Pin-Fin Heat Sink. PCIM Europe 2017; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, Germany, pp. 1-8.
